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Applications
1. IT Datacom Servers
2. Storage Devices
3. High Performance Computing (HPC)
4. Base station(AAU)
5. OCP NIC3.0
6. EDSFF
Features and Benefits
1. Support cable to board and board to board application: 1.57mm PCB card thickness compatible with PCIe riser card
2. Multiple channels are optional: 1C(56pos.), 2C(84pos.), 4C (140pos.) and 4C+
3. Small size design: pitch 0.6mm connector
4. Support power and high speed signal transmission together
5. Supports 85 ohm impedance applications
6. 30-34AWG are available for both discrete and ribbon cable
7. Combined Power solution, high speed and sideband
Mechanical Performance
1. Mating force: 31N maximum
2. Unmating force: 6N minimum
3. Rated durability cycles: 25 cycles minimum
Electrical Performance
1. Voltage: 30VAC per contact
2. Current: 0.5A per signal contact, 1.1A per power contact
3. Contact resistance: 30mohm max. initial, 15mohm maximum change after stress test
4. Dielectric Withstanding Voltage: 300 VDC minimum for 100 ms
5. Insulation Resistance: 10 MΩ minimum between adjacent pins
Signal Integrity
1. PCIe Gen5
2. PCIe Gen6(can be upgrade to PCIe Gen6)
3. 56G PAM4
4. 112G PAM4(can be upgrade to 112G PAM4)
Product Environmental Compliance
1. RoHS2.0: Compliant
2. China RoHS: Yes
3. REACH SVHC: Yes
4. Low-Halogen Status: Not Reviewed
Packing
Per Amphenol‘s Site Operating Procedure #SOP-708 REV 2
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